Thermal interface materials having hybrid fillers for enhancing through-thickness thermal conductance and increasing electrical resistance

碩士 === 國立成功大學 === 材料科學及工程學系 === 107

Bibliographic Details
Main Authors: Che-JueiWu, 吳哲睿
Other Authors: Jyh-Ming Ting
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/wzw6hv