One Step Interconnect Fabrication using Copper Oxide Hybrid Pastes by Photonic Sintering
碩士 === 國立中興大學 === 材料科學與工程學系所 === 107 === One of the trends in microelectronics fabrication is to manufacture highly conductive interconnections at a low processing temperature using fine metallic particles. Considering the low heat-tolerance of polymeric substrates, high cost of Au and Ag, as well a...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/cgi-bin/gs32/gsweb.cgi/login?o=dnclcdr&s=id=%22107NCHU5159053%22.&searchmode=basic |