Effects of Au on bondability, microstructures, and mechanical properties of ternary Ag-based alloy bonded wires
博士 === 國立中興大學 === 材料科學與工程學系所 === 107 === This study aimed to investigate the Au effect on bondability, microstructures and mechanical properties of ternary Ag-based alloy wires. Silver-based bonding wires have drawn remarkable attention in the packaging industry because they are cheaper and more con...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/cgi-bin/gs32/gsweb.cgi/login?o=dnclcdr&s=id=%22107NCHU5159031%22.&searchmode=basic |