Interfacial reactions between high current electroplated copper and tin
碩士 === 國立中興大學 === 化學工程學系所 === 107 === This thesis is to study the interfacial reaction between copper and tin. When current density increases, with different additives added in electroplating copper, and reacted with tin to suppress the formation of interfacial voids in the IMC (intermetallic compou...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/pnshtd |