Study of variations of quality inspection on Wire Bond IMC (Intermetallic Compound)

碩士 === 明新科技大學 === 工業工程與管理系碩士在職專班 === 108 === IMC (intermetallic compound) is kind of a very important property for wire bond process in assembly. The specification is that the percentage of the contact surfaces of IMC must be higher than standard between Gold (Au) ball and Aluminum (Al) pad. Wi...

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Bibliographic Details
Main Authors: WANG,ZENG-MIN, 王贈閔
Other Authors: Wu, Chia-Hsin
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/rkcqgh