Analysis of Flexible Polyimide-based Resistive Random Access Memories under Bending Strains

碩士 === 逢甲大學 === 電子工程學系 === 107 === These days the mainstream nonvolatile memory is flash memory, but with the process technology of device miniature, flash memory will be facing many problems, such as leakage of the dielectric layer and excessive operating voltage. Among ReRAM has attracted attentio...

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Bibliographic Details
Main Authors: WU, CHUNG-YU, 吳崇宇
Other Authors: YANG, WEN-LUH
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/r49e56