Automation Design of Auto Tray in IC Packing System

碩士 === 中原大學 === 機械工程研究所 === 107 === Abstract The main focus of this report is to develop an automatic operation system for IC component packaging and accomplish modular design and application purpose so that completely replacing manual work. Based upon the recoding data measured in the production pr...

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Main Authors: Yu-Hung Hsieh, 謝育虹
Other Authors: Ting Yung
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/rma578
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spelling ndltd-TW-107CYCU54890052019-05-30T03:57:34Z http://ndltd.ncl.edu.tw/handle/rma578 Automation Design of Auto Tray in IC Packing System IC封裝分量機之自動化設計研究 Yu-Hung Hsieh 謝育虹 碩士 中原大學 機械工程研究所 107 Abstract The main focus of this report is to develop an automatic operation system for IC component packaging and accomplish modular design and application purpose so that completely replacing manual work. Based upon the recoding data measured in the production process of IC component packaging, the demanding production technology is thus defined. Also, considering the automation problems in the process of IC packaging, modular design of mechanism for pick-and-place operation and the classification of IC components by using vision-based inspection is carried out. Tray (pallet) is probably the most commonly used material handling equipment to contain IC components. Following the way of manually insert the IC component into the tray, a SCARA robot is integrated with a vision system to grab IC components and insert them into the tray. That is, the vision system is able to recognize the position and shape of the IC components, which provides important information for the four degree-of-freedom SCARA robot to define the pick-and place trajectory and calculate the number of the picked IC components, and achieve the goal of classification. Also, via the vision-based inspection, the source pallet edge and bevel directivity are measured to identify the positioning accuracy. In practical operation of the integrated system manipulating from tray A to tray B, the positioning accuracy is 0.03mm, and 3 pieces are failed in 3200 pieces of IC component under the production speed of 95pcs/min, which indicates the error rate is 0.09% far below the requirement of 0.3%.The developed system is verified to reach the target of reducing the problem of product shortage and pollution due to unsteady manual work so that improving the overall production efficiency. Key Words: IC Tray, Vision-based inspection, SCARA Robot. Ting Yung 丁鏞 2019 學位論文 ; thesis 60 zh-TW
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language zh-TW
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description 碩士 === 中原大學 === 機械工程研究所 === 107 === Abstract The main focus of this report is to develop an automatic operation system for IC component packaging and accomplish modular design and application purpose so that completely replacing manual work. Based upon the recoding data measured in the production process of IC component packaging, the demanding production technology is thus defined. Also, considering the automation problems in the process of IC packaging, modular design of mechanism for pick-and-place operation and the classification of IC components by using vision-based inspection is carried out. Tray (pallet) is probably the most commonly used material handling equipment to contain IC components. Following the way of manually insert the IC component into the tray, a SCARA robot is integrated with a vision system to grab IC components and insert them into the tray. That is, the vision system is able to recognize the position and shape of the IC components, which provides important information for the four degree-of-freedom SCARA robot to define the pick-and place trajectory and calculate the number of the picked IC components, and achieve the goal of classification. Also, via the vision-based inspection, the source pallet edge and bevel directivity are measured to identify the positioning accuracy. In practical operation of the integrated system manipulating from tray A to tray B, the positioning accuracy is 0.03mm, and 3 pieces are failed in 3200 pieces of IC component under the production speed of 95pcs/min, which indicates the error rate is 0.09% far below the requirement of 0.3%.The developed system is verified to reach the target of reducing the problem of product shortage and pollution due to unsteady manual work so that improving the overall production efficiency. Key Words: IC Tray, Vision-based inspection, SCARA Robot.
author2 Ting Yung
author_facet Ting Yung
Yu-Hung Hsieh
謝育虹
author Yu-Hung Hsieh
謝育虹
spellingShingle Yu-Hung Hsieh
謝育虹
Automation Design of Auto Tray in IC Packing System
author_sort Yu-Hung Hsieh
title Automation Design of Auto Tray in IC Packing System
title_short Automation Design of Auto Tray in IC Packing System
title_full Automation Design of Auto Tray in IC Packing System
title_fullStr Automation Design of Auto Tray in IC Packing System
title_full_unstemmed Automation Design of Auto Tray in IC Packing System
title_sort automation design of auto tray in ic packing system
publishDate 2019
url http://ndltd.ncl.edu.tw/handle/rma578
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