Automation Design of Auto Tray in IC Packing System
碩士 === 中原大學 === 機械工程研究所 === 107 === Abstract The main focus of this report is to develop an automatic operation system for IC component packaging and accomplish modular design and application purpose so that completely replacing manual work. Based upon the recoding data measured in the production pr...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/rma578 |