Warpage Simulation Analysis for Fan-out Panel Level Packaging Process
碩士 === 國防大學理工學院 === 機械工程碩士班 === 107 === Fan-out panel-level packaging (FOPLP) technology is known as next-generation fan-out technology because of its high throughput and thin package. However, warpage may occur in the FOPLP process, which causes subsequent yield and reliability problems. Therefore,...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8g32d7 |