A Learning-Based SPICE Simulation Framework for Fast Power Integrity Check
碩士 === 元智大學 === 資訊工程學系 === 106 === As semiconductor processing technology advances, transistor and interconnect feature sizes are continually shrinking for high-level integration. The side effect results in increasing effective voltage drop on the metal wires. The voltage drop effect would lead to c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/s6nfea |