Silica Abrasive Modified by Sodium Aluminate for Chemical Mechanical Polishing
碩士 === 元智大學 === 化學工程與材料科學學系 === 106 === Chemical mechanical planarization (CMP) is a very effective process which is widely used today for planarization of various materials. The main cost of the CMP process is the polishing pad and slurry. The polishing slurry accounts for about 70% of the total. T...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/hp3676 |