Research in curing of polydimethylsiloxane with epoxy group

碩士 === 國立雲林科技大學 === 化學工程與材料工程系 === 106 === This research uses H-PDMS modification to composite Polydimethyl Siloxane which contains epoxy groups and also uses different methods to cross-link.The purpose is to produce an elastic elastomer that can be used in new types of circuit boards.The study impl...

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Bibliographic Details
Main Authors: CHEN,XIN-HAO, 陳信豪
Other Authors: LIAW,WEN-CHANG
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/z5n7q8