Contact Adhesion of Plated NiW/Cu Metallization for Si Solar Cells
碩士 === 國立雲林科技大學 === 材料科技研究所 === 106 === Replacing Ag paste contacts in silicon solar cells by plated Ni/Cu contacts offer potential advantages of finer grid lines, lower series resistance, and reduced costs in industrial Si solar cell manufacturing. To achieve acceptance in the market for a new plat...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64xu4x |