Study of Pad Metal Void Improvement in Copper Wire Bond Process

碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === For developing compact electronic products, circuit under pad structure was developed in wafer level, in the high hardness copper (Cu) wire bonding process, this structure may suffer the impact and cause yield loss. This thesis is focused on the st...

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Bibliographic Details
Main Authors:	Jui-hung Hung, 洪睿紘
Other Authors:	Ming Chang Shih
Format:	Others
Language:	zh-TW
Published:	2018
Online Access:	http://ndltd.ncl.edu.tw/handle/fyhb7y

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spelling	ndltd-TW-106NUK014420162019-05-16T00:37:22Z http://ndltd.ncl.edu.tw/handle/fyhb7y Study of Pad Metal Void Improvement in Copper Wire Bond Process 銅線製程對鋁墊缺鋁改善參數研究 Jui-hung Hung 洪睿紘碩士國立高雄大學電機工程學系-電子構裝整合技術產業碩士專班 106 For developing compact electronic products, circuit under pad structure was developed in wafer level, in the high hardness copper (Cu) wire bonding process, this structure may suffer the impact and cause yield loss. This thesis is focused on the study of the process window in copper wire bonding process with different characteristic metal void element. Process parameters designed by JMP methods were applied in this study. With the analysis, optimized process parameters can be achieved. The final working verification was applied to study the yield improvement. Ming Chang Shih 施明昌 2018 學位論文 ; thesis 55 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === For developing compact electronic products, circuit under pad structure was developed in wafer level, in the high hardness copper (Cu) wire bonding process, this structure may suffer the impact and cause yield loss. This thesis is focused on the study of the process window in copper wire bonding process with different characteristic metal void element. Process parameters designed by JMP methods were applied in this study. With the analysis, optimized process parameters can be achieved. The final working verification was applied to study the yield improvement.
author2	Ming Chang Shih
author_facet	Ming Chang Shih Jui-hung Hung 洪睿紘
author	Jui-hung Hung 洪睿紘
spellingShingle	Jui-hung Hung 洪睿紘 Study of Pad Metal Void Improvement in Copper Wire Bond Process
author_sort	Jui-hung Hung
title	Study of Pad Metal Void Improvement in Copper Wire Bond Process
title_short	Study of Pad Metal Void Improvement in Copper Wire Bond Process
title_full	Study of Pad Metal Void Improvement in Copper Wire Bond Process
title_fullStr	Study of Pad Metal Void Improvement in Copper Wire Bond Process
title_full_unstemmed	Study of Pad Metal Void Improvement in Copper Wire Bond Process
title_sort	study of pad metal void improvement in copper wire bond process
publishDate	2018
url	http://ndltd.ncl.edu.tw/handle/fyhb7y
work_keys_str_mv	AT juihunghung studyofpadmetalvoidimprovementincopperwirebondprocess AT hóngruìhóng studyofpadmetalvoidimprovementincopperwirebondprocess AT juihunghung tóngxiànzhìchéngduìlǚdiànquēlǚgǎishàncānshùyánjiū AT hóngruìhóng tóngxiànzhìchéngduìlǚdiànquēlǚgǎishàncānshùyánjiū
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Study of Pad Metal Void Improvement in Copper Wire Bond Process

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