Study of Pad Metal Void Improvement in Copper Wire Bond Process
碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === For developing compact electronic products, circuit under pad structure was developed in wafer level, in the high hardness copper (Cu) wire bonding process, this structure may suffer the impact and cause yield loss. This thesis is focused on the st...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/fyhb7y |