The Study of Negative Photoresist Reduction Issue for Bump Formation Process
碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === This thesis is to study the photoresist reduction parameter in the bumping negative photoresist coating process. Statistical parameter analysis were carried out by using normal distribution verification and analysis of variance verification. The si...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49xyyb |