Metallurgical Reactions of Various Thickness of Sn-Ag Solder with Ni and Cu Layer
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 106 === When the packaging industry moves to 3D IC packaging, flip-chip solder joints has been replaced by microbumps for interconnects. The solder height for a flip-chip joint is approximately 70m, and it decrease to about 15 m for a microbump. In addition, t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/rcam2g |