Application of Electroless Copper Plating on Photo-imageable Dielectric Material by Reactive Palladium Nanoparticles
碩士 === 國立交通大學 === 理學院應用科技學程 === 106 === Electroless-deposition Copper (E’less Cu) is one of most commend technique in electronic package industry. In this work, two step surface modification technique is applied to set up an attachable surface by using RCA-SC1 (standard clean process of semiconducto...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/ev8xr9 |