Analyzing the Relationship between the Maximum Roughness and the Minimum Strength of Dice
碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 106 === Wafer Level Chip Size Package (WLCSP) has made significant contributions for electronic devices getting shrink in recent years. When WLCSP die is assembled in Surface Mounted Device (SMD) process, it is exposed and assembled directly onto the system board....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/paf29n |