Analysis of thermal strain for FCFBGA with Copper Pillar Bump
碩士 === 國立成功大學 === 機械工程學系 === 106 === This thesis uses finite element analysis software ANSYS17.0 Workbench to simulate the thermal strain behavior of the flip-chip fine-pitch ball grid array(FCFBGA) package structure with copper pillar bumps, and is studied the fatigue life of the bump solder (Sn3.5...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/rzevvh |