Investigation of Electromigration Reliability of Flip-chip Packages by Electrothermal Coupling Analysis
博士 === 國立成功大學 === 機械工程學系 === 106 === The electromigration reliability of solder interconnects is dominated by current density and temperature inside the interconnects. For flip-chip packages, current densities around the regions where traces connect a solder bump increase by a significant amount owi...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/n7pb8c |