The electrochemical ion migration behavior and the afterwards formation of dendritic nanostructures of silver alloy wire
碩士 === 國立成功大學 === 材料科學及工程學系 === 106 === Silver alloy wires have attracted attention in the electronic packaging industry because of their many characteristics such as low electrical resistance and high thermal conductivity. In this study, the commercial silver-palladium alloy wires were current stre...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/6zy793 |