| Summary: | 碩士 === 明新科技大學 === 工業工程與管理系碩士班 === 106 === Window Ball Grid Array, wBGA is a package type which is using for dynamic random access memory unlike other packages, the front of chip is down then the wire is through the window on the substrate to connection the chip and the finger of the substrate and then reduced the length of the wire path. Chips are stick on the substrate by using epoxy. Therefore the most important topic is to figure out the optimized process parameters to improve the bond line thickness quality, speed up production and improve product quality.
To improve the bond line thickness and productivity of die bonding process of wBGA package. This paper introduced the Six Sigma DMAIC methodology and Taguchi method to figure out the optimized bonding parameters of wBGA in order to reduce the variation of bond line thickness. And by optimizing the parameters and rigorous process parameters management to enhance the process capacity and establishment the control system for key process parameters. Finally, standardize the operations to ensure product quality optimization and stability.
The case study company use one of their product for this study, after using the optimized parameters the average of bond line thickness of die bonding is improved from 33.59um to 36.35um and the standard deviation from 2.77um to 2.08um, Finally the process capacity Cpk is upgraded from 1.05 to 1.41, This result shows that this optimization parameter does improve the process capability and product quality.
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