A Study of The Die Bond Parameters of wBGA by Using Six Sigma Methodology
碩士 === 明新科技大學 === 工業工程與管理系碩士班 === 106 === Window Ball Grid Array, wBGA is a package type which is using for dynamic random access memory unlike other packages, the front of chip is down then the wire is through the window on the substrate to connection the chip and the finger of the substrate and th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/z7putu |