Application of Surfactants in Wafer Dicing Process
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系碩士在職專班 === 106 === This paper focuses on the application of surfactant in wafer dicing process to increase the reliability of IC packages. The material which dropped from wafer is magnetic pollutant in wafer dicing process. Those materials are easy to attach aluminum...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/m32vxk |