Integration of Heterogeneous Suspension Film Sensing Elementswith Flip Chip Technology

• Main Authors: LAI,LI-TSEN, 賴俐岑
• Other Authors: CHENG,TSUNG-CHIEH
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/seh8n3

碩士 === 國立高雄應用科技大學 === 機械工程系 === 106 === 　　Due to the coming of IoT ( internet of Thing), and vigorous development of various chips skill, a lot of sensing component are applied during our daily life gradually. Multi-functional, light and short component is the main goal for the thesis. The principal of research paper is using the skill of Microelectromechanical Systems,MEMS to make Pressure Sensor and enlarging circuit chips. integrating both entirely different heterogeneous components to use Flip Chip instead of wire bonding for formerly component enclosing skill. For the processing aspect of Pressure Sensor, we use Poly-Si as pressure resistance material to electroplate copper/tin on the bump of Pressure Sensor to act as connection point, and we use Inductively Coupled Plasma Reactive Ion Etch to conduct hollowing silicon base plate. We keep polysilicon and membrane of silica (approximately 2um) as suspension membrane type for pressure resistance structure. The research is to use skill of Flip Chip to integrate the both heterogeneous components, and then to achieve the purpose of multi-function and miniature shrink.