Integration of Heterogeneous Suspension Film Sensing Elementswith Flip Chip Technology

碩士 === 國立高雄應用科技大學 === 機械工程系 === 106 ===   Due to the coming of IoT ( internet of Thing), and vigorous development of various chips skill, a lot of sensing component are applied during our daily life gradually. Multi-functional, light and short component is the main goal for the thesis. The principal...

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Bibliographic Details
Main Authors: LAI,LI-TSEN, 賴俐岑
Other Authors: CHENG,TSUNG-CHIEH
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/seh8n3