| Summary: | 碩士 === 國立高雄應用科技大學 === 電子工程系 === 106 === The System-in-package (SIP) technology possess the advantages to decrease the printed circuit board (PCB) area, reduce the number of PCB layers and the electromagnetic interference signal interference on passive or active components. Therefore, the formation of system-level packaging is universal to apply a large number of applications for jet dispensing in the semiconductor process. Because jet dispensing has the merits of simple structure, low cost, and low droplet positioning transport technology. It can be applied to system-level packaging of related micro-mechanical, micro-component manufacturing and mold-free molding.
The purpose of this thesis is to study and find out the optimal parameter setting of jet dispensing and the best dispensing needle design. There are included the viscosity of the glue, the pressure of the push glue, the stroke of the striker and the internal depth of the dispensing needle. We adjustment and reduce the quality of the process caused by the offset of the rubber material. This thesis provides the M company Fxxxx dispenser to carry the Aerojet Pump by using the Taguchi experimental planning method to find the optimal combination of parameters. In the experiment, the charge coupling device (CCD) was adopted to take the drop precision of the glue drop. The shooting was mainly for the drop position of the glue drop by using different parameter combinations were used to achieve the minimum offset of the glue during the conveyance process.
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