The research of the optimizing design for the glue jetting pump shooting accuracy
碩士 === 國立高雄應用科技大學 === 電子工程系 === 106 === The System-in-package (SIP) technology possess the advantages to decrease the printed circuit board (PCB) area, reduce the number of PCB layers and the electromagnetic interference signal interference on passive or active components. Therefore, the formation o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/h2ty5h |