Evaluation of Application Feasibility of Black Solder Resist Film for Preparation of Embedded Substrate

碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系博碩士班 === 106 === Abstract The embedded structure carrier board is a thin type carrier board formed by inserting an integrated circuit (IC) into the inside of the print circuit board. Forming the exterior of an embedded structure carrier board with the black dry film...

Full description

Bibliographic Details
Main Authors: HUANG,YUNG-CHIH, 黃勇智
Other Authors: Yen,u-San
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/h9w3w9