| Summary: | 碩士 === 中原大學 === 機械工程研究所 === 106 === Nowadays, EPE is the most commonly applied package material when packing the electronics hardware. However, the demand of better package materials is increasing since the environmental awareness is arising. To fulfill the need of environment protection, we use paper to replace EPE as cushion material gradually. The benefits of using paper cushion material include fewer damage to environments and more recycling. Therefore, efficient paper package design is important to industry.
In this study, we took EPE and paper as two individual materials to design cushion package base on the same box and cushion buffer distance. Each box contains one 2U server node and will be tested on vibration and drop. The ANSYS software simulated and analyzed the EPE stress. According to the research result, the shock resistance of paper cushion is weaker than EPE foam. However, the performance of product protection was increased after optimizing paper cushion design which brings “no impact of shipping cost” . The optimized package enhanced the shock resistance and had the same protecting effect. As a result, by enhancing paper cushion package design, we can reduce the using of EPE foam and benefit the environmental protection.
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