Evaluation of expanded polyethylene foam and paper used for buffer packaging
碩士 === 中原大學 === 機械工程研究所 === 106 === Nowadays, EPE is the most commonly applied package material when packing the electronics hardware. However, the demand of better package materials is increasing since the environmental awareness is arising. To fulfill the need of environment protection, we use pap...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/85evz4 |