| Summary: | 碩士 === 國立中正大學 === 機械工程系研究所 === 106 === According to the enhancement of LCD technique, the requirements of
lighter, thinner, shorter, and smaller products have become a trend for the
LCD industry. The typical driver IC, Chip On Film Packaging (COF), has
to improve the design to meet the target of high performance with high I/O
count. Compared with the traditional package, the die in COF needs to be
designed as a slender shape with high slenderness ratio. It can be easily
caused damage by the adhesive force between bonding UV type and die
during die pick up process. Therefore, to investigate breaking strength of
high slenderness ratio die, and analyze the die bond pick up parameters are
very important research topics.
In this research, we use Four Point Bending (4PB) test to measure the
limited breaking force of slender shape die and use the technology of high
speed camera to capture whole experimental process clearly, and satisfy
the thickness die will not slip during the 4PB test. Moreover, finite element
simulation model about 4PB was developed to obtain the breaking stresses
for slender shape die as the design limit for pick up process. About adhesive
test, the normal test and shear test will be setup to find the cohesive element
parameter range, at last, use Tauguchi method to choose the value from the
parameter range, use the die pick up experiment with high speed camera
and simulation to find the correct cohesive parameter.
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