Strength Test of Slender Die and Development of Glue Characteristic Parameters in Die Pick Up Process
碩士 === 國立中正大學 === 機械工程系研究所 === 106 === According to the enhancement of LCD technique, the requirements of lighter, thinner, shorter, and smaller products have become a trend for the LCD industry. The typical driver IC, Chip On Film Packaging (COF), has to improve the design to meet the target of hig...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/wd3rcs |