Study of enhancement in brightness of Chip Scale Package
碩士 === 元智大學 === 光電工程學系 === 105 === CSP is the latest memory wafer packaging technology. It allows wafer area and packaging area ratio exceeds 1: 1.14 and it is almost close to 1: 1. The absolute size is only 32mm2, which is one-third of ordinary BGA packaging, and one-sixth of TSOP package. Comparin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/ntvkyy |