Improvement of Blind Via Drilling by UV Laser Processing
碩士 === 元智大學 === 機械工程學系 === 105 === Main purpose of blind via drilling by laser processing is making of connection between layer and layer of copper foil lines, especially for the application of chip substrate product. According to the trend of small blind via, needs to improve the existing blind via...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/pfm9pw |