Preparation and Characterization of Polishing Slurry Composition on Stainless Steel Substrates for Chemical Mechanical Polishing Processes
碩士 === 元智大學 === 化學工程與材料科學學系 === 105 === Chemical mechanical polishing (CMP) is early applied in lens and wafers, it has been an important technology in of semiconductor manufacturing. It has been proved that stainless steel could be the substrate in solar cell and planarization of global substrate i...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/uwq6m2 |