The Study on Process Improvement of Multi-Layer Organic Substrate

• Main Authors: TSUNG-TA HE, 何宗達
• Other Authors: Ho-Chiao Chuang
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/fvsbks

碩士 === 國立臺北科技大學 === 機電整合研究所 === 105 === In this study micro electromechanical system (MEMS) technology was used to fabrication of multi-layer organic substrate protect structure, by lithography, copper electroplating, and mechanical polishing. Because of the line width limit of multi-layer organic substrate solder mask, that the small line width copper wire can’t not be protected. Therefore, the probe assembly to the multi-layer organic substrate, it must have been contact to the copper layer without any solder mask protect. The probe card is often faulty, so it is the focus of this paper to protect the copper wire that is bare on the multilayer organic substrate. In this study, we use lithography process to build photoresist structure of about 2000 holes, 35μm in diameter and 45μm in depth, and filled the copper metal in the form of electroplating. The part of the exposed copper wire on the multilayer organic substrate is protected and is individually independent and in contact with the probe. This study used positive photoresist, as a structural layer. Because of the high and low drop structure of 25μm, resulting in the packaging of copper wire photoresist, through the spin coating surface is not completely flat. Use chemical mechanical polishing to polish to copper wire all iv exposed and flattened. To solve the problem of multi-layer organic substrate exposed copper, making the probe card probe can be exposed to separate copper, greatly reducing the probe card failure rate.