Study on Preparation of h-BN/PU Elastic Composites and Properties of Thermal Conductivity
碩士 === 國立臺北科技大學 === 製造科技研究所 === 105 === Recently, due to the miniaturization of electronic products, its life is limited by cooling efficiency. The packaging composite materials needs high thermal conductivity. Among these fillers, boron nitride has good thermal conductivity, electrical insulation a...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/h858av |