Study of Vacuum Application on the Molding Process in IC Packaging
碩士 === 國立高雄大學 === 電機工程學系碩博士班 === 105 === As miniaturization and lighter requirements for electronic devices, molding technical became more and more advanced and surmounted. The technological of molding flow control was more improtant since the new design for stacking die or muti-die design product,...
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| Format: | Others |
| Language: | zh-TW |
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2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/yj9t7w |
| Summary: | 碩士 === 國立高雄大學 === 電機工程學系碩博士班 === 105 === As miniaturization and lighter requirements for electronic devices, molding technical became more and more advanced and surmounted. The technological of molding flow control was more improtant since the new design for stacking die or muti-die design product, which product easily to encounter inner or external mold void.
This article focus on application of vacum system functional study for plastic ball grid array (PBGA) product which did not change any material and parameter, investigating and using vacuum system to assisted special molding flow packing electronic devices and analysis raw data for applicability.
Keywords: IC Packaging、PKG Void 、Vacuum system 、Multilayer
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