Study of Vacuum Application on the Molding Process in IC Packaging
碩士 === 國立高雄大學 === 電機工程學系碩博士班 === 105 === As miniaturization and lighter requirements for electronic devices, molding technical became more and more advanced and surmounted. The technological of molding flow control was more improtant since the new design for stacking die or muti-die design product,...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/yj9t7w |