Evaluation of the Reliability of Wire Bonding by Analyzing Thermal and Electrical Properties of Bonded Wire
碩士 === 國立高雄大學 === 電機工程學系碩博士班 === 105 === Wire bonding plays an important role for signal transfer and electrical connection of IC package and its reliability would impact on product functional and electrical characterization. Requirement for electrical and thermal characteristics of wire bonding bec...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/w9y2cc |