Study on Structural Strength in Die Stacking Process

• Main Authors: YANG, HUI-CHING, 楊惠卿
• Other Authors: LAN, WEN-HOW
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/3k4r4j

碩士 === 國立高雄大學 === 電機工程學系碩博士班 === 105 === In assembly process, one of the important processes is die preparation including wafer grinding and sawing. The stress will be concentrated on the scratch defect point in grinding process. This phenomenon will cause potential crack, chipping and peeling defects to impact the manufacturing quality. The investigation focus of the thesis is the performance difference of die strength and stacking overhang capability between DP (die preparation) and SDBG (Stealth Dicing Before Grinding) process. With three point strength test, AFM (Atomic Force Microscopy) and Shadow Moiré test, the die strength, surface roughness morphology and warpage behavior for different processed dies can be characterized. The wire bonding strength tested by ball shear and wire pull test were applied to judge stacking capability. The investigation shows that thin die strength is caused by bending deformation during Three Point Strength Test. The SDBG process can enhance the die strength and reduce the die crack risk.