Study on Structural Strength in Die Stacking Process
碩士 === 國立高雄大學 === 電機工程學系碩博士班 === 105 === In assembly process, one of the important processes is die preparation including wafer grinding and sawing. The stress will be concentrated on the scratch defect point in grinding process. This phenomenon will cause potential crack, chipping and peeling defec...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/3k4r4j |