Research on Dynamic Contact Reliability Analysis of Spring Probe under Current Load
碩士 === 國立高雄大學 === 電機工程學系碩博士班 === 105 === Most interfaces are using the spring probe to do chip or package testing that the major function is connecting the signal and power between DUT and ATE. The life time of the spring probe will most important performance but the life time specification of the s...
Main Authors: | Chiu, Pang-Cheng, 邱邦誠 |
---|---|
Other Authors: | Wu, Sung-Mao |
Format: | Others |
Language: | zh-TW |
Published: |
2017
|
Online Access: | http://ndltd.ncl.edu.tw/handle/01491952861788635804 |
Similar Items
-
A Universal Spring-Probe System for Reliable Probing of Electrochemical Lab-on-a-Chip Devices
by: Moon-Keun Lee, et al.
Published: (2014-01-01) -
Architectural Evaluations on TSV Redundancy for Reliability Enhancement
by: Chiu, Chien Pang, et al.
Published: (2016) -
Study of Contact Reliability for Cantilever Probe Card of Wafer Testing
by: Jun-Ming Baw, et al.
Published: (2008) -
Failure Analysis and Reliability Assessment of the Spring-Loaded Safety Valves
by: Yeou-Guang Jou, et al.
Published: (2003) -
Modelling of contact interaction of structures with the base under dynamic loading
by: Anatoliy Lukashevich
Published: (2019-09-01)