Research on Dynamic Contact Reliability Analysis of Spring Probe under Current Load

碩士 === 國立高雄大學 === 電機工程學系碩博士班 === 105 === Most interfaces are using the spring probe to do chip or package testing that the major function is connecting the signal and power between DUT and ATE. The life time of the spring probe will most important performance but the life time specification of the s...

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Bibliographic Details
Main Authors: Chiu, Pang-Cheng, 邱邦誠
Other Authors: Wu, Sung-Mao
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/01491952861788635804