Study on Diamond Wire Sawing Process Using Minimum Quantity Lubrication with AL2O3 Nanofluids
碩士 === 國立臺灣科技大學 === 機械工程系 === 105 === Diamond wire sawing is mainly used cutting process for slicing semiconductor substrate. During the cutting process, cutting fluid is applied to help reduce workpiece temperature, chip removal and other effects. Application of the fluid can greatly improve the qu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/485j49 |