Study of power TFET-IGBT with SiGe channel layer

碩士 === 國立臺灣科技大學 === 電子工程系 === 105 === The ideal characteristics of power device are low on-resistance and high blocking voltage. For a high blocking voltage, the conventional power MOSFET has an unacceptably high on-resistance. The problem of on-resistance is solved by the IGBT structure, but there...

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Bibliographic Details
Main Authors: Yan-Fu Jhou, 周彥甫
Other Authors: Miin-Horng Juang
Format: Others
Language:en_US
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/363z44
Description
Summary:碩士 === 國立臺灣科技大學 === 電子工程系 === 105 === The ideal characteristics of power device are low on-resistance and high blocking voltage. For a high blocking voltage, the conventional power MOSFET has an unacceptably high on-resistance. The problem of on-resistance is solved by the IGBT structure, but there are four alternative semiconductors in IGBT structure, which can procure latch-up phenomenon. It is found that the TFET structure can improve this condition. Because there are only three alternative semiconductors (p-n-p) in the TFET-IGBT structure, the device can alleviate latch-up. In order to improve the on-current of TFET-IGBT, the narrow bandgap material, SiGe, has been used as channel layer, which can cause a low on-state voltage drop without latch-up problem. In addition, devices with various active region width and trench depth will be discussed