Development of Interconnection Technology for PowerIntegrated Circuit Module by using Au-Sn Bonding Material
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 105 === IGBT (Insulated Gate Bipolar Transistor) power IC module can efficiently increase the conversion efficiency of transforming electricity to kinetic energy, and consequently has attracted increasing amount of attentions. For electrical vehicle applications, th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96052268676007108848 |