Research on Improving the Sound Insulation of Punching Distribution for Multi-Layer Partition

碩士 === 國立臺灣海洋大學 === 系統工程暨造船學系 === 105 === In this paper, we mainly study the punching of the interlayer of multi-layer sandwich plate to simulate the different punching distribution by filling the cushioning material or maintaining the air layer, and study the change of the sound transmission loss....

Full description

Bibliographic Details
Main Authors: Wang, Kuei-Fu, 王奎夫
Other Authors: Liou, Der-Yuan
Format: Others
Language:zh-TW
Published: 2017
Online Access:http://ndltd.ncl.edu.tw/handle/j2vw6c

Similar Items